3C Masana'antar Kayan Lantarki

Kyakkyawan Aiki Yana Taimakawa 3C Daidaitaccen Samar da Kayan Lantarki

Babban Bayani

Ana amfani da na'urori masu auna firikwensin Lanbao a cikin samar da guntu, sarrafa PCB, marufi na LED da IC, SMT, taron LCM da sauran hanyoyin masana'antar lantarki na 3C, suna ba da mafita ga daidaiton samarwa.

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Bayanin aikace-aikacen

Ana iya amfani da na'urar Lanbao ta hanyar firikwensin hoto na katako, firikwensin fiber na gani, firikwensin baya baya, firikwensin lakabi, firikwensin firikwensin Laser mai tsayi da dai sauransu za a iya amfani da shi don kula da tsayin PCB, sa ido kan isar da guntu, marufi mai haɗaka da sauran gwaje-gwaje a cikin masana'antar lantarki.

Rukunin rukuni

Abun ciki na prospectus

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Kula da Tsawon PCB

Ta hanyar firikwensin photoelectric na katako na iya gane gajeriyar nisa da kulawar tsayin tsayin PCB mai tsayi, kuma firikwensin matsuguni na Laser na iya auna tsayin abubuwan PCB daidai da gano manyan abubuwan da aka gyara.

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Kulawar Isar Chip

Ana amfani da firikwensin fiber na gani don gano guntu bacewar guntu da tabbatar da ɗaukar guntu a cikin ƙaramin sarari.

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Shirye-shiryen Semiconductor

Ƙwararren firikwensin hoto na bayanan baya yana gano daidai yanayin wucewar wafer, kuma ana amfani da firikwensin ramin U-dimbin ramin don dubawa da sakawa akan wurin wafer.