Kōkua maikaʻi loa i ka 3C Electronic Precision Production
Ka wehewehe nui
Hoʻohana nui ʻia nā sensor Lanbao i ka hana ʻana i ka chip, ka hana PCB, LED a me ka IC component packaging, SMT, LCM hui a me nā kaʻina hana ʻē aʻe o ka ʻoihana uila 3C, e hāʻawi ana i nā hopena ana no ka hana pololei.
Ka wehewehe noi
Hiki ke hoʻohana ʻia ʻo Lanbao ma o ka beam photoelectric sensor, optical fiber sensor, background suppression sensor, label sensor, high-precision laser ranging sensor etc.
Māhele ʻāpana
Maʻiʻo o ka prospectus
Ka nānā ʻana i ke kiʻekiʻe PCB
Ma o ka beam photoelectric sensor hiki ke hoʻomaopopo i ka mamao pōkole a me ke kiʻekiʻe kiʻekiʻe o ka nānā ʻana i ke kiʻekiʻe PCB, a hiki i ka laser displacement sensor ke ana pololei i ke kiʻekiʻe o nā ʻāpana PCB a ʻike i nā ʻāpana ultra-kiʻekiʻe.
Mākaʻikaʻi Kipi
Hoʻohana ʻia ka mea ʻike fiber Optical no ka ʻike nalo ʻana o ka puʻupuʻu a me ka hōʻoia ʻana i ka ʻohi chip ma kahi liʻiliʻi loa.
Hoʻopili Semiconductor
Hoʻomaopopo pololei ka mea ʻike kiʻi kiʻi hoʻopau hope i ke kūlana hala o ka wafer, a hoʻohana ʻia ka mea ʻike U-like slot no ka nānā ʻana a me ka hoʻonohonoho ʻana i ka wafer.