Intsebenzo ebalaseleyo inceda ukuveliswa kwemveliso ye-3C
Inkcazo enkulu
I-LENBAO ESENTRS isetyenziswe ngokubanzi kwimveliso ye-Chip, ukulungiswa kwe-PCB, ukupakisha kwecandelo kunye ne-ICMT kunye neMicimbi ye-ITT, iNdibano ye-Elecm, iNdibano ye-Electronics, ibonelela ngezisombululo zomlinganiso kwimveliso yokuchaneka.
Inkcazo yesicelo
I-lanbao's nge-fotoser ye-fotoptor, i-fiber firnsor, i-inssor yokufaka i-iles, ukubeka iliso kwilessor, ibeka iliso kwi-Inser ePlb njl njl njl njl njl.
Ii-sundegegeges
Umxholo wePRESTUTUS
Ukubeka iliso kwi-PCB
Ngombhalo wefoto yeBeam Ifoto unokuqonda umgama omfutshane kunye nokubekwa kweliso eliphezulu le-PCB ephezulu, kwaye isivamvo sokususwa kwe-Shorction sinokulinganisa ngokuchanekileyo ukuphakama kwezinto ze-PCB kwaye zichonge izinto eziphezulu ze-Ultra.
Ukuhanjiswa kwe-Chip UkuBeka iliso
I-fiber sensor ye-fiber isetyenziselwa ukuhlolwa kwe-chip engekhoyo kunye nesiqinisekiso sokukhetha i-chip kwindawo encinci kakhulu.
Ukupakishwa kwe-semicondcuct
I-Insor yokucinezelwa kwefoto yoxinzelelo lweefoto ichaza ngokuchanekileyo imeko ye-wafer, kwaye inzwa ye-U-Dlot Slot isetyenziselwa ukuhlolwa kwendawo kunye nokuma.