Ukusebenza Okuhle Kakhulu Kusiza Ukukhiqizwa Kwe-3C Kwe-Electronic Precision
Incazelo Eyinhloko
Izinzwa ze-Lanbao zisetshenziswa kabanzi ekukhiqizeni ama-chip, ukucutshungulwa kwe-PCB, ukupakishwa kwengxenye ye-LED kanye ne-IC, i-SMT, umhlangano we-LCM nezinye izinqubo zemboni ye-electronics ye-3C, ehlinzeka ngezixazululo zokulinganisa zokukhiqiza ngokunemba.
Incazelo Yohlelo Lokusebenza
I-Lanbao's ngokusebenzisa inzwa ye-photoelectric ye-beam, inzwa ye-fiber optical, inzwa yokucindezela ingemuva, inzwa yelebula, inzwa yokunemba okuphezulu kwe-laser esukela njll. ingasetshenziselwa ukuqapha ubude be-PCB, ukuqapha ukulethwa kwe-chip, ukupakishwa kwengxenye yesekethe edidiyelwe nokunye ukuhlola embonini ye-elekthronikhi.
Izigaba ezingezansi
Okuqukethwe kwe-prospectus
PCB Height Monitoring
Ngenzwa ye-photoelectric ye-beam ingabona ukuqapha kobude bebanga elifushane nokunemba okuphezulu kwe-PCB, futhi inzwa yokususwa kwe-laser ingakala ngokunembile ubude bezingxenye ze-PCB futhi ihlonze izingxenye eziphakeme kakhulu.
I-Chip Delivery Monitoring
Inzwa ye-fiber optical isetshenziselwa ukutholwa kwe-chip engekho kanye nokuqinisekiswa kokuthathwa kwe-chip endaweni encane kakhulu.
I-Semiconductor Packaging
Inzwa ye-photoelectric yokucindezelwa kwangemuva ihlonza ngokunembile isimo sokudlula se-wafer, futhi inzwa yesikhala esimise u-U isetshenziselwa ukuhlola nokubeka i-wafer endaweni.