Ukusebenza okuhle kusiza ukukhiqizwa kwe-3c ngo-elekthronikhi nge-elektroniki
Incazelo Main
Izinzwa zeLanbao zisetshenziswa kabanzi ekukhiqizeni kwe-chip, ukucubungula i-PCB, i-LED ne-IC kanye ne-IC, i-ASSERCED YENZAKALAYO kanye nezinye izinqubo zomkhakha we-3c Electronics, ukuhlinzeka ngezixazululo zokulinganisa zokukhiqizwa okunengqondo.
Ukuchazwa kwesicelo
I-Lanbao's nge-Beam Photelectric Sensor, inzwa ye-Fiber ye-Optical fiber, inzwa yeleveli yelebula, ukupela okuphezulu kweLaser Rangeng njll. Kungasetshenziswa ukubhekwa kwe-PCB ukuphakama, ukuhanjiswa kwengxenye ye-chip okuhlanganisiwe kanye nokunye ukufakwa kwezolo embonini ye-elekthronikhi.
Izigatshana
Okuqukethwe kwe-Prospectus
I-PCB Height Monitoring
Nge-Beam PhotoElectric Sensor ingathola ukuqapha amabanga amafushane nokunemba okuphezulu kwe-PCB ukuphakama, futhi inzwa yokuxoshwa kwe-laser ingakulinganisa ngokunembile ukuphakama kwezakhi ze-PCB futhi ikhombe izingxenye ze-Ultra-high.
Ukuqapha Ukulethwa Kwe-Chip
I-Optical Fiber Sensor isetshenziselwa ukutholwa okungekho kwe-Chip nokuqinisekiswa kwe-Chip Pick-up esikhaleni esincane kakhulu.
Ukupakishwa kwe-semiconductor
Inzwa yokucindezela ngemuva kwesizinda ikhomba ngokunembile isimo esidlulayo se-wafer, futhi inzwa ye-u-shape slot isetshenziselwa ukuhlolwa okusizeni nokubeka endaweni.