Yikuphi inzwa yokucindezela isizinda se-PhotoElectric?
Ukucindezelwa kwangemuva ukuvinjwa kwangemuva, okungathinteki izinto zangemuva.
Le ndatshana izokwethula inzwa yokucindezelwa ingemuva ye-PST ekhiqizwe yiLanbao.
Izinzuzo Zomkhiqizo
⚡ Ikhono elinamandla lokulwa nokuphazamisa
Igobolondo lama-aesthetics wezimboni, isakhiwo se-optical esisezingeni eliphakeme kanye nokwakheka kwesifunda okuhlanganisiwe kuphelelisana, ngekhono eliphakeme lokukhanya elingaphandle lokuphazamiseka kokuphazamiseka kwe-PST Barcencress, futhi lingakwesabi ukutholwa kombala. , izingxenye ezicwebezelayo kancane zingatholakala kalula.
⚡ Ukunemba okuphezulu kwendawo
Usayizi nokwakheka kwendawo yokukhanya yimingcele esemqoka yokulinganisa okubonakalayo, okuthinta ngqo ukunemba kokuma. Ukucindezelwa kwangemuva kweLanbao PST kusiza ukwakheka okunembile okungokoti okuphezulu kanye ne-High Rescient Speed Design ukusiza ukuma okunembile.
⚡ Ukuguqulwa Okuqondile Okuqondile
Usayizi nokwakheka kwendawo yokukhanya yimingcele esemqoka yokulinganisa okubonakalayo, okuthinta ngqo ukunemba kokuma. Ukucindezelwa kwangemuva kweLanbao PST kusiza ukwakheka okunembile okungokoti okuphezulu kanye ne-High Rescient Speed Design ukusiza ukuma okunembile.
I-Wire 45 ° Igcina isikhala
Indlela yendabuko ye-wiring kungenzeka ukuthi ayinakwenzeka ukufaka ezikhaleni ezincanyana. ILanbao iklama ama-45 ° izintambo zezikhala ezincanyana zokuhlangabezana nezidingo zokufaka amakhasimende.
⚡ insimbi engagxiliwe engenacala, ngamandla aphezulu
I-Engineering Design, eshunyekwe ngezinto ezingenasici, amandla aphezulu, ukumelana nokugqwala kanye nempilo yenkonzo ende.
Izinja
Kusukela kwethulwa kwayo, iLanbao Miniature PhotoElectric PST Series isetshenziswe kabanzi ku-3c, amandla amasha, ama-semiconductor kanye nezimboni ezipakisha ngenxa yokusebenza okuqinile kokuphazamiseka kanye nokuqina okunamandla. Ngaphezu kochungechunge lwe-Supression Olwethulwe Yasemuva olusanda kwethulwa, iLanbao futhi inephothifoliyo yomkhiqizo ephelele kanye nohluzo lomkhiqizo oluqinile, olufanele i-PST ngokusebenzisa ibanga le-25cm, nebanga lesizinda, nokuvinjwa kwangemuva ngebanga le-80mm.
Ukuhlolwa kwe-Silicon Wafer
Ukuhlolwa kwebhodlela cap
Ukutholwa kwesithwali
Ukutholwa kwe-Chip
Isikhathi sePosi: Aug-17-2022